LAC High Performance Benchtop Oven
The LAC benchtop oven features horizontal recirculating airflow and exceptional temperature uniformity. The features of the LAC make it ideal for performing many applications in the electronics market, such as curing non-volatile adhesives on electronic components, performing aging and life-cycle testing of electronics and plastic components.
LCC & LCD Clean Process Benchtop Oven
Despatch’s LCC and LCD clean process benchtop ovens feature stainless steel interiors and exteriors, programmable process controls, and optional nitrogen atmosphere. These features make the LCC/LCD ideal for electronics market applications such as semiconductor packaging; die bond, epoxy and adhesive curing; and wafer processing.
PBC and PNC Burn-In Cabinet Oven
These burn-in cabinet ovens are engineered specifically for applications such as high dissipation forward bias, high-temperature reverse bias, dynamic and static burn-in of IC, RAM, ROM, microprocessors and other semiconductor devices. Available in air and nitrogen atmosphere.
PCO2-14™ Polyimide Curing Oven
The PCO2-14™ Polyimide Cure solution is a clean process oven designed for electronics market applications that require low oxygen: polyimide and epoxy curing, baking and sterilizing. The PCO2-14™ optimizes the polyimide curing process for semiconductor wafer devices.
PC Series Conveyor Ovens
Despatch PC Series Conveyor Ovens achieve superior temperature uniformity in all interior parts due to high-volume, vertical down airflow. The continuous belt design is ideal for large quantities of similar work pieces being processed. Typical electronics applications include curing, drying, heat treating and pyrolysis of tantalum capacitors.
RBC Benchtop Burn-In Oven
Despatch’s RBC Burn-In Benchtop Ovens offer maximum flexibility for small lot qualification testing, burn-in, reliability testing, and research and development for the electronics market.
OVENS FOR ELECTRONIC COMPONENTS AND SEMICONDUCTORS
Manufacturers trust Despatch ovens to deliver the uniform and repeatable thermal processing required for critical components to operate flawlessly and ensure reliable product performance. Despatch never cuts corners, the products we build are manufactured to the highest standards. A Despatch oven is able to deliver invariable, uniform temperature for as long as the oven is in service thanks to its solid build quality.
Despatch has successfully addressed the many technical challenges of thermal processing for capacitors, resistors and other electronic components used in cell phones, disc players, televisions and other devices.
From ceramic capacitor bakeout to preheating, drying and curing, Despatch provides the uniform temperatures and gradual ramp rates that are essential to these processes. Despatch ovens can control air velocities, either up or down, at ±5% or better, with temperature uniformity at ±5°C or better.
BURN-IN AND TESTING
Integrated Circuits (IC’s) and other electronic devices are burned in at elevated temperatures to stress and exercise the devices under test. The high temperatures force early failure, known as “infant mortality”, at this point rather than later when they are in use in a finished product. This dramatically improves the reliability of the product.
Despatch has developed a strong reputation in the burn-in market over the last 30 years and has thousands of systems in operation throughout the world. The system’s proven reliability and ability to meet uniformity requirements has helped build that reputation. Having worked closely with this industry for many years has also allowed Despatch to understand the unique needs of the end users.
Despatch is the world’s premier supplier for clean process, low oxygen, fast cycle curing of adhesives and polymers used in high-volume semiconductor packaging and assembly.
Electronic Devices and Semiconductor: Adhesive bonding and curing, Encapsulant curing, Underfill curing of CMOS optical sensors, Die attach and BGA, B-Stage adhesive curing, Reliability testing, Polyimide curing, Burn-in and testing, Metalic thin film annealing, Polyimide curing, Photoresist curing, Reliability testing
Electronic Components: Pre-Heating, Bake Out, Drying, Curing, Annealing, Solder Reflow