With over 100 years of experience, Despatch has provided equipment for nearly every thermal processing application and has the technical capability to modify existing designs to meet next generation requirements.

Burn-in testing methods often involve final product stress testing but can also be used for several reliability-based evaluations that can help with improving manufacturing standards.

Despatch is a leader on burn-in and environmental chambers for semiconductor devices and electronic products.

The burn-in method and environmental test chamber is a testing and quality control process used to evaluate product quality and reliability to identify manufacturing flaws and weaknesses before they are sold or integrated into larger systems. By simulating environmental conditions within a contained space, the chamber offers test results that can show the process of product decay and degradation and help predict the potential lifespan of a product or material.

Despatch industrial batch ovens are ideal for burn-in applications for electronic components, devices, and assemblies. Applications such as high dissipation forward bias, high-temperature reverse bias, dynamic and static burn-in of IC, RAM, ROM, microprocessors and other semiconductor devices.

Electronic Devices and Semiconductor: Adhesive bonding and curing, Encapsulant curing, Underfill curing of CMOS optical sensors, Die attach and BGA, B-Stage adhesive curing, Reliability testing, Polyimide curing, Burn-in and testing, Metalic thin film annealing, Polyimide curing, Photoresist curing, Reliability testing

Electronic Components:  Pre-Heating, Bake Out, Drying, Curing, Annealing, Solder Reflow

Devices that survive a burn-in period are usually free of early failures and other operational problems. Regardless of your industry, you can depend upon Despatch burn-in systems for all your testing requirements.