A new study from the University of Hawaiʻi at Mānoa’s College of Engineering has revealed a method to significantly improve the bonding strength of silicone materials used in soft devices — a development that could bolster the durability and reliability of medical implants, wearable tech, and soft robotics.
The innovation addresses a longstanding challenge in the field: ensuring that layers or components of silicone elastomers stick together well during manufacturing, especially under varying heat and curing times.
Silicone elastomers, known for their flexibility, stability, and compatibility with the human body, are widely used in applications ranging from fitness trackers to artificial muscles. However, the performance of these devices often hinges on how well the materials bond together during production. Poor bonding can lead to leaks, structural failures, or reduced lifespan in devices designed to bend and stretch with human movement.
In research published in Science Advances on July 16, Assistant Professor Te Faye Yap and her co-authors developed a new framework to predict bonding strength in silicone-based materials. By carefully analyzing the curing process — the heat and time applied to set the material — the team identified optimal windows for bonding. If done too early or too late, the chemical reactions between silicone layers are insufficient to create a strong seal. Done at just the right time, however, bonding results in joints that are significantly more robust.
Yap, who began the research while earning her PhD at Rice University, collaborated with researchers from both Rice and Tulane University. “Strong, consistent bonding is crucial to prevent leaks and device failure,” said Yap. “This framework expands the design and fabrication toolkit for silicone elastomeric devices—an advancement that aligns with the College of Engineering’s vision for on-island advanced manufacturing and innovation in Hawaiʻi.”
The team demonstrated the method’s effectiveness by building soft robotic components that curved 50% more than typical models and by 3D-printing silicone structures with more than double the usual bond strength. The model remained reliable even when curing conditions were adjusted to speed up production, a critical factor in commercial settings.
This advancement is expected to support next-generation designs in wearable electronics, medical implants, and flexible robotics by offering a reliable, generalized process to produce stronger, longer-lasting silicone-based devices.
Image & article source: University of Hawaiʻi
