The electronic adhesives market was estimated around $3.0 billion in 2013, largely due to Asia-Pacific and RoW controlling the highest share of the market together at roughly 60%.
The electronic adhesives market falls mainly into three segments, electrically conductive, UV curing, and thermally conductive. The thermally conductive adhesives usually contain epoxy, silicone, or acrylics.
The global market is projected to grow at a CAGR of 10.1% from 2014 to 2019 to reach $5.5 billion by 2019.
The Asia-Pacific region should see the highest investment and growth as a result of the growing application markets, specifically in China.
The electronic adhesives market in the RoW region is estimated to experience the second highest growth at 6.80% from 2014 to 2019, with H.B. Fuller (U.S.) and Henkel AG & Company (Germany) set to be the two major forces. These two companies alone accounted for over 60.0% of the total market activities from 2010 to 2014.
