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Industrial Ovens for the Electronics Industry
 

 

 

Featured solutions
LAC HIGH-PERFORMANCE
LCC/LCD CLEAN PROCESS
PC02-14 POLYMIDE CURE
PC SERIES CONTINUOUS
RBC STACKABLE BURN-IN
 

APPLICATIONS

Components

  • Pre-heating
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  • Bake out
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  • Drying
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  • Pyrolysis
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  • Curing
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  • Annealing
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  • Solder reflow
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Data storage
  • Magnetically annealing recording
    heads and aluminum and glass disk
    drive media
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  • MRAM semiconductor process tools
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Fiber optics
  • Adhesive bonding and curing
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  • Telcordia testing and burn-in
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Semiconductor assembly/
wafer-level packaging
  • Encapsulant, BCB
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  • CMOS optical and underfill curing
    sensor processing
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  • Die attach and BGA
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  • B-Stage adhesive curing
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  • Reliability testing
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  • Polyimide curing
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  • Burn-in and testing
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  • Thermal shock
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Semiconductor front-end
  • Magnetic annealing
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  • Wafer-level burn-in
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  • Metallic thin film annealing
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  • Polyimide curing
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  • Photoresist curing
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  • Reliability testing
ELECTRONICS

Despatch has been involved in the electronics industry for decades. We have made a recognizable name for ourselves in the semiconductor industry. Despatch equipment performs front-end semiconductor functions like wafer-level burn-in and magnetic annealing, as well as assembly/waferlevel packaging functions such as die attach curing, reliability and burn-in testing and thermal shock. Data storage, micro processor and component companies utilize Despatch equipment for their annealing, drying and pyrolysis needs. Tool handling ovens are also available.

Semiconductor manufacturing

Despatch Industries is the world’s premier supplier for clean process, low oxygen, fast cycle curing of adhesives and polymers used in high-volume semiconductor packaging and assembly.
Industrial Ovens for the Semiconductor IndustrySuperior temperature uniformity of ± 0.5% of setpoint
SEMI S2/S8, CE, SECS/GEM communication
• Low particulate envi ronmental controls to protect contamination
Low oxygen levels to prevent oxidation
Wafer level tracking and other optional multi-chip packaging integration

Components

Despatch Industries has successfully addressed the many technical challenges of thermal processing for capaci tors, resistors and other electronic components used in cell phones, disc players, televisions and other devices.

From ceramic capacitor bakeout to preheating, drying and curing, Despatch provides the uniform temperatures and gradual ramp rates that are essential to these processes. For pyrolysis applications, Despatch utilizes an all-stainless steel interior to resist corrosion. Despatch ovens can control air velocities, either up or down, at ±5% or better, with temperature uniformity at ±5°C or better.

Data Storage

Despatch Industries offers unmatched capabilities for the thermal processing of critical data storage components such as hard drives, recording heads and aluminum and glass disk drive media.
• Lube baking to permanently bond coatings onto disk media for improved durability
• Disk annealing for aluminum substrate disks
• Substrate curing for glass-substrate disk drives
• Magnetic annealing