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Standard Features:

  • High volume production
  • Exceptional thermal uniformity ± 1°C in the dwell region
  • Closed loop temperature controls
  • Advanced graphical user interface
  • Safe, simple chamber accessibility
  • High production up-time
  • Ease of maintenance




View In-Line Diffusion Furnace video, diffusion technology for the industry’s most uniform emitters. (1:27)



A plasma system is available for chemical- free conditioning of the wafer surface.



The Despatch Diffusion Furnace combined with USI’s Deposition tool is a reliable system for highly uniform emitters.

DF In-Line Diffusion System

Diffusion Technology for the Industry’s Most Uniform Emitters

The Despatch In-line Diffusion Furnace incorporates advanced infrared thermal technology that provides the tight temperature uniformity needed for increased cell efficiencies. Air is passively preheated as it enters the chamber and lamps on top and bottom along with edge heaters effectively transfer heat to the wafers. Automated drop-down access to the chamber reduces maintenance time and the insulation in the first zones of the furnace is easily removed if it becomes contaminated. The furnace provides advanced profile capability and a fully comprehensive software system.

In-line processing offers reduced wafer handling and greater throughput than batch processing. With less handling you will have less breakage and increased yield. The Despatch Diffusion Furnace combined with USI’s Deposition tool consistently produces highly uniform emitters using aqueous-based doping. This repeatability enables higher sheet resistances, excellent yields and optimum cell efficiency.

  DF 3630
Physical Configuration
System size (length x width x height) 15,329 × 1,870 × 1,750 mm (603.5 x 74 x 69 inches)
Standard entrance table 914 mm (36 inch)
Heated length 10,516 mm (414 inch)
Cooling length 1,829 mm (72 inch)
Standard exit table 914 mm (36 inch)
Conveyor type Lightweight balance spiral weave, Nichrome V material
Conveyor height above floor 97.8 cm +/-3.6 cm (38.4 in +/-1.5 in)
Product clearance 6.4 mm (0.25 inch)
Number of Lanes (156 x 156 mm) 5
Conveyor width 914 mm (36 inch)
Process Capabilities
Maximum temperature 1000 °C (1832 °F)
Approx. throughput (156 x 156 mm) 1200-1400 wafers/hr
Conveyor speed range 10–100 cm/min (4-40 ipm)
Conveyor speed accuracy ± 0.5%
Conveyor speed control Closed loop feedback
Wafer size 100x100, 125x125, 156x156 mm (4, 5, 6 inch) Option for 210 x 210 mm (8 inch) support
Sheet resistance 40 to >120 ohm/sq configurable

 

Options:

  • Water-cooled heat exchanger
  • Failed element monitor
  • Master production control interface
  • Profiling systems
  • Ultrasonic belt cleaner/dryer
  • Uninterruptible power supply
  • Extended process profiles
  • Conveyor table extensions
  • CE Compliance
  • Product Specialists
    Despatch's product specialists are trained
    to help quickly find a right product for
    your process or application.
    Custom products
    THE LOW RISK CHOICE FOR YOUR
    COMPLEX CHALLENGES
    Contact
    1-952-469-5424   1-888-337-7282
    info@despatch.com  sales@despatch.com


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