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Industry Standard CF-Series Metallization Furnace
- Tight thermal control
- High throughput
- High yield - no breakage
- Profile matching
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- Next generation technology
- Microzone Technology
- Rapid thermal ramping up to 175°C/sec
- Enhanced cooling up to 250°C/sec
- Wavelength tuned firing process
- Infinite profile flexibility
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IL-RTS Rapid Thermal Shock
- This revolutionary tool features a simple, in-line
process that applies a low temperature thermal
spike to solar cells, eliminating the need for
low-bow paste
- Removes wafer bow without decreasing efficiency
- Customers can test wafers to see if the bow
can be reduced
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AG and AL Screen Printer
- A very flexible production printer mounted in a
rectangular frame with a reciprocating substrate
carriage
- Small production scale, 300-400 wafers/hour
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